To address the challenges posed by highly corrosive plasmas in semiconductor processes, traditional alumina and yttria (Y2O3) performance limitations were overcome, establishing high-purity yttria and structurally unique yttrium oxyfluoride (YOF) as next-generation core materials for plasma erosion resistance. To mitigate particle contamination caused by wear on transmission components, a multicomponent composite wear-resistant ceramic system (e.g., Cr2O3-Y2O3) was developed. Medium-to-high entropy dielectric ceramics, such as silver niobate with B-site doping and lead zirconate with A/B-site dual doping, were designed, forming a complete specialized protective material system for semiconductor equipment. Through high-temperature solid-phase reactions and spray granulation techniques, the phase purity ( ≥99.9%) and sphericity of YOF powder were resolved. An integrated "powder-structure-property" preparation technology was proposed, achieving cross-scale precise control from atomic-level lattice distortion to microcolumnar/equiaxed composite structures in coatings via optimized plasma spraying. This enables controllable and consistent coating performance. Based on the new material system and preparation technology, a full-area protective coating system was established for critical surfaces such as electrostatic chucks, chamber liners, and transmission components. YOF coatings extend the corrosion resistance lifespan of chamber liners and focusing rings by 3-5 times, significantly reducing metal contamination and particle generation while lowering wafer defect rates by over 30%. In wafer transport systems, the multicomponent composite ceramic coating triples the wear resistance of mechanical components, effectively eliminating wafer contamination and equipment stalling caused by wear particles.